Specification: Diamond height 12MM

Diameter 4.5″/115MM, Bore 22.23MM/7/8″, Segment thickness 2.3MM

Application:

Hard material, reinforced concrete, hard granite, hard brick etc.

Feature:

Dry cutting, Laser welding provide best welding strength avoid segment-off.

New Technology in diamond array, its 3D distribution guarantees sufficient use of each diamond particle

More efficient, fast and stable in cutting

12MM segment height provide much longer life